At Aktis Engineering , as a team we have multiple decades of experience in developing Technologies, Platforms and Solutions using Microcontrollers for multiple verticals including Automotive, Semiconductor, Healthcare , Home/Building  Automation , IoT/Connected Devices/Could Systems , Electric Vehicles and Industrial .
The team driven purely by technological passion is genuinely interested in supporting customers with the best-in-class solutions to meet the Electronics customer requirements. We truly believe that our association would be fruitful, long lasting and mutually rewarding.

Our Mantra : Adaptability  to the latest advancements in technologies without losing sight of simple and clean solutions to get high performance and flexibility.  Our team has a long lasting and proven track record in building solutions at scale for masses.

Our R&D experts with broad portfolio of leading-edge design tools, can transform your idea from initial concept to production-ready designs.

EMBEDDED PRODUCT ENGINEERING  

  • New Product Design – Automotive, Healthcare/Medical, Semiconductor, Consumer , Industrial, Consumer and Agricultural
  • Design expertise in Digital, Analog, Mixed, FPGA and RF designs
  • Software/Firmware and Test tools development – C, C++, QT, Python, JS, DB
  • Firmware development platforms- ARM, MIPS, 8-bit, 16-bit Micros, various microcontroller families
  • Boot code / BSP development
  • Linux Kernels and Drivers
  • RTOS Configuration and Drivers
  • Mobile / Desktop Apps (Android, iOS, Linux, Windows)
  • Mechanical Design and Electronics system integration
  • IoT Devices & Cloud Apps – Smart Industries, Smart Living, Smart Enterprises
  • PLC  programming

SILICON VALIDATION

  • Silicon Validation and Customer Evaluation platform design and prototyping
  • Silicon bring-up, Functional Validation and PVT Characterization
  • Test Automation for functional validation and PVT Characterization
  • Expertize in USB, PCIe Switch and Ethernet PHY / Switch validation
  • USB (Type-C / PD), Ethernet (PHY / Switches), PCIe Gen 3/4 Pre-Compliance & Certification

HIGH SPEED PCB LAYOUT DESIGN & ANALYSIS

  • High-speed designs with SI/PI and Thermal analysis , Recommended PCB Stack-up and low-loss material suggestion
  • Design experience with Microprocessors and Microcontrollers , Memory , Analog , Power , HMI and Wireless
  • Digital Interface : USB ,SATA, SD , HDMI, PCIe, DDR3/4, SERDES (QSGMII/SGMII), Ethernet (Copper, Optical), SPI, I2C, I2S, UART , RS485 , MIPI , CAN etc.
  • Placement: Through Hole, SMD, Smallest 01005 (0.41mm x 0.20mm), parts at 45⁰ angle, Edge Fingers, DFM, DFT
  • Routing: High Speed signals, Impedance matched, Blind & Buried Via, Backplanes, Power distribution.
  • PCB Proto-typing, Product Mass production and Production test Software development
  • Packages: TH, SMD, QFP, QFN, DQFN, BGA’s: Pitch: 0.4mm, Ball Size: 0.2mm, Balls/Pins: 2800
  • PCB types: Flex, Flex-Rigid, Rigid, 4.1 mm thick, 24 Layers, Low Loss PCBs, V-Groove / Routing cuts.
  • Platform bring-up and Qualification
  • Production testing tools and fixture Design
  •  Turnkey solution provider aimed at servicing customers in the areas of Automotive, Agricultural, Consumer, Healthcare/Medical, Semiconductors and Industrial domains
  • DFX Analysis (DFM, DFA, DFT, etc.)
  • PCB Reverse Engineering
  • Compliance with IPC 2221, 2222 , Milspec

MANUFACTURING CAPABILITIES

  • High mix, low to medium volume assemblies
  • SMD, Through Hole, PCB Surface finishes
  • RoHS and Conventional process
  • Automated optical inspection (AOI)
  • In-circuit and flying probe test
  • DFM reviews and yield analysis
  • Conformal coating, encapsulation
  • Total traceability manufacturing process
  • POP (Package on Package assembly) : 0.4mm & 0.6mm pitch
  • 32 BGAs, 10K components / board done.
  • Mechanical Enclosure and Box build (Test , Packaging & Marking)

CERTIFICATION

  • Agency Certification – FCC,CE etc .
  • FDA for Healthcare products